Semiconductor devices and methods of manufacturing semiconductor devices

ABSTRACT

In one example, a semiconductor device includes a substrate having leads that include lead terminals, lead steps, and lead offsets extending between the lead steps so that at least some lead steps reside on different planes. A first electronic component is coupled to a first lead step side and includes a first electronic component first side, and a first electronic component second side opposite to the first electronic component first side. A second electronic component is coupled to a second lead step side, and includes a second electronic component first side, and a second electronic component second side opposite to the second electronic component first side. An encapsulant encapsulates the first electronic component, the second electronic component, and portions of the substrate. The lead terminals are exposed from a first side of the encapsulant. Other examples and related methods are also disclosed herein.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of co-pending U.S. patentapplication Ser. No. 17/328,861 filed on May 24, 2021, and issued asU.S. Pat. No. 11,694,946 on Jul. 4, 2023, which is incorporated byreference herein and priority thereto is hereby claimed.

TECHNICAL FIELD

The present disclosure relates, in general, to electronic devices, andmore particularly, to semiconductor devices and methods formanufacturing semiconductor devices.

BACKGROUND

Prior semiconductor packages and methods for forming semiconductorpackages are inadequate, for example resulting in excess cost, decreasedreliability, relatively low performance, or package sizes that are toolarge. Further limitations and disadvantages of conventional andtraditional approaches will become apparent to one of skill in the art,through comparison of such approaches with the present disclosure andreference to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a cross-sectional view of an example semiconductor device.

FIG. 1B shows a perspective view of an example semiconductor device.

FIG. 1C shows a bottom view of an example semiconductor device.

FIG. 1D shows a transparent perspective transparent view of an examplesemiconductor device.

FIGS. 2A, 2B, 2C, 2D, and 2E show cross-sectional views of an examplemethod for manufacturing an example semiconductor device.

FIGS. 3A, 3B, and 3C show cross-sectional views of an examplesemiconductor device.

FIG. 4A shows a cross-sectional view of an example semiconductor device.

FIG. 4B shows a perspective view of an example semiconductor device.

FIG. 4C shows a bottom view of an example semiconductor device.

FIG. 4D shows a transparent perspective view of an example semiconductordevice.

FIGS. 4E, 4F, and 4G show cross-sectional views of example method formanufacturing an example semiconductor device.

FIGS. 4H and 4I show cross-sectional views of example semiconductordevices.

FIG. 5A shows a cross-sectional view of an example semiconductor device.

FIG. 5B shows a perspective view of an example semiconductor device.

FIG. 5C shows a bottom view of an example semiconductor device.

FIG. 5D shows a transparent perspective view of an example semiconductordevice.

FIGS. 5E and 5F show cross-sectional views of example method formanufacturing an example semiconductor device.

FIGS. 5G and 5H show cross-sectional views of an example semiconductordevice along reference line A and reference line B respectively of FIG.5D.

The following discussion provides various examples of semiconductordevices and methods of manufacturing semiconductor devices. Suchexamples are non-limiting, and the scope of the appended claims shouldnot be limited to the particular examples disclosed. In the followingdiscussion, the terms “example” and “e.g.” are non-limiting.

The figures illustrate the general manner of construction, anddescriptions and details of well-known features and techniques may beomitted to avoid unnecessarily obscuring the present disclosure. Inaddition, elements in the drawing figures are not necessarily drawn toscale. For example, the dimensions of some of the elements in thefigures may be exaggerated relative to other elements to help improveunderstanding of the examples discussed in the present disclosure. Thesame reference numerals in different figures denote the same elements.

The term “or” means any one or more of the items in the list joined by“or”. As an example, “x or y” means any element of the three-element set{(x), (y), (x, y)}. As another example, “x, y, or z” means any elementof the seven-element set {(x), (y), (z), (x, y), (x, z), (y, z), (x, y,z)}.

The terms “comprises,” “comprising,” “includes,” and/or “including,” are“open ended” terms and specify the presence of stated features, but donot preclude the presence or addition of one or more other features.

The terms “first,” “second,” etc. may be used herein to describe variouselements, and these elements should not be limited by these terms. Theseterms are only used to distinguish one element from another. Thus, forexample, a first element discussed in this disclosure could be termed asecond element without departing from the teachings of the presentdisclosure.

Unless specified otherwise, the term “coupled” may be used to describetwo elements directly contacting each other or describe two elementsindirectly coupled by one or more other elements. For example, ifelement A is coupled to element B, then element A can be directlycontacting element B or indirectly coupled to element B by anintervening element C. Similarly, the terms “over” or “on” may be usedto describe two elements directly contacting each other or describe twoelements indirectly coupled by one or more other elements.

DESCRIPTION

In an example, a semiconductor device includes a substrate having leadsthat include lead terminals, lead steps, and lead offsets extendingbetween the lead steps so that at least some lead steps reside ondifferent planes. A first electronic component is coupled to a firstlead step side and includes a first electronic component first side, anda first electronic component second side opposite to the firstelectronic component first side. A second electronic component iscoupled to a second lead step side, and includes a second electroniccomponent first side, and a second electronic component second sideopposite to the second electronic component first side. An encapsulantencapsulates the first electronic component, the second electroniccomponent, and portions of the substrate. The lead terminals are exposedfrom a first side of the encapsulant.

In an example, a semiconductor device includes a substate having a firstlead and a second lead. The first lead includes a first lead terminal, afirst lead step coupled to the first lead terminal and residing on afirst plane, a first lead offset coupled to the first lead step, asecond lead step coupled to the first lead offset and residing on asecond plane that is different than the first plane, a second leadoffset coupled to the second lead step, and a third lead step coupled tothe second lead offset and residing on a third plane that is differentthan the second plane. The second lead includes a second lead terminal,a fourth lead step coupled to the second lead terminal and residing on afourth plane, a third lead offset coupled to the fourth lead step, afifth lead step coupled to the third lead offset and residing on a fifthplane that is different than the fourth plane, a fourth lead offsetcoupled to the fifth lead step, and a sixth lead step coupled to thefourth lead offset and residing on a sixth plane that is different thanthe fifth plane. A first electronic component is coupled to the firstlead. A second electronic component is coupled to the second lead. Anencapsulant encapsulates the first electronic component, the secondelectronic component, and portions of the substrate. The first leadterminal and the second lead terminal are exposed from a first side ofthe encapsulant.

In an example, a method of manufacturing a semiconductor device includesproviding a substrate with leads. The leads include lead terminals, leadsteps, and lead offsets extending between the lead steps so that atleast some lead steps reside on different planes. The method includescoupling a first electronic component to a first lead step side. Thefirst electronic component includes a first electronic component firstside, and a first electronic component second side opposite to the firstelectronic component first side. The method includes coupling a secondelectronic component to a second lead step side. The second electroniccomponent includes a second electronic component first side, and asecond electronic component second side opposite to the secondelectronic component first side. The method includes providing anencapsulant encapsulating the first electronic component, the secondelectronic component, and portions of the substrate, wherein the leadterminals are exposed from a first side of the encapsulant.

Other examples are included in the present disclosure. Such examples maybe found in the figures, in the claims, and/or in the description of thepresent disclosure.

FIG. 1A shows a cross-sectional view of an example semiconductor device10. FIG. 1B shows a perspective view of semiconductor device 10. FIG. 1Cshows a bottom view of semiconductor device 10. FIG. 1D shows aperspective transparent view of semiconductor device 10 at a later stageof manufacturing. In the example shown in FIGS. 1A to 1D, semiconductordevice 10 can comprise electronic components 11 and 12, substrate 15,and encapsulant 16.

Electronic components 11 and 12 can comprise component interconnects 111and 121. In some examples, substrate 15 can comprise or be referred toas a leadframe. In the example shown in FIG. 1A, electronic components11 and 12 can be coupled to top and bottom portions of substrate 15.

Substrate 15, encapsulant 16, and component interconnects 111 and 121can protect the electronic components 11 and 12 from an external factorand/or environmental exposure. Substrate 15 and component interconnects111 and 121 can provide electrical coupling between an externalcomponent and electronic components 11 and 12.

FIGS. 2A, 2B, 2C, 2D, and 2E show cross-sectional views of examplemethod for manufacturing an example semiconductor device. FIGS. 2A to 2Eare cross-sectional views taken along the line A-A of FIG. 1D.

FIG. 2A shows a cross section view of electronic device 10 at an earlystage of manufacture. In the example shown in FIG. 2A, electroniccomponent 11 can be provided with component interconnects 111.Electronic component 11 can be coupled to substrate 15 through componentinterconnects 111. In the example shown in FIG. 2A, electronic device 10can comprise or be referred to as a semiconductor component, asemiconductor die, a semiconductor chip or a semiconductor package. Insome examples, electronic component 11 can comprise at least one of anapplication specific integrated circuit, a logic die, a micro controllerunit, a memory, a digital signal processor, a network processor, a powermanagement unit, an audio processor, an RF circuit, a sensor, or awireless baseband system on-chip processor. In some examples, the bodyof electronic component 11 can have a thickness of about 80 μm to about250 μm.

In some examples, component interconnects 111 can be located or providedat a first side of electronic component 11. In some examples, the firstside of electronic component 11 can be referred to as a front side or anactive side of electronic component 11 where device structures can belocated. Component interconnects 111 can be input, output, signal, orpower terminals of electronic component 11. Component interconnects 111can be coupled to substrate 15. In some examples, componentinterconnects 111 can comprise or be referred to as die pads or bondpads. For example, component interconnects 111 can comprise electricallyconductive materials, such as metal materials, aluminum, copper,aluminum alloys, or copper alloys. In some examples componentinterconnects 111 can comprise conductive ball/bump such assolder-ball/bump, conductive pillar such as Cu-pillar, or conductivepost such as Cu-pillar with solder-tip. In some examples componentinterconnects 111 can have a width of about 40 μm to about 160 μm, or athickness of about 50 μm to about 90 μm.

FIG. 2B shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2B, electroniccomponent 11 can be coupled to substrate 15. In some examples, couplingof electronic component 11 with substrate 15 can be achieved by a reflowprocess or a laser-assisted bonding process. In some examples, substrate15 can comprise or be referred to as a leadframe.

Substrate 15 can comprise leads 151 and 152 spaced apart from eachother. In some examples, leads 151 and 152 can be referred to asfingers. In some examples, substrate 15 can have a thickness of about100 μm to about 250 μm.

Lead 151 can comprise lead steps 151 a, 151 b, and 151 c, lead offsets151 x and 151 y, and lead terminal 151 z. Lead steps 151 a, 151 b, and151 c, lead offsets 151 x and 151 y, and lead terminal 151 z can beintegral with each other as part of a same or continuous piece. In someexamples, lead steps 151 a, 151 b, 151 c, lead offsets 151 x, 151 y, orlead terminal 151 z, can be defined by stamping, bending, or etching.

Lead step 151 a can extend substantially horizontal, or substantiallyparallel to the first side of electronic component 11. The inner end oflead step 151 a can face towards electronic component 11 and the outerend can face away from electronic component 11. Lead step 151 a can becoupled by a tie-bar to neighboring lead steps 151 a. Lead step 151 acan be an example of a lead step residing on a first plane, such as ahorizontal plane, as generally illustrated in FIG. 2B.

Lead offset 151 x can be coupled to the inner end of lead step 151 a.The outer end of lead offset 151 x can be coupled to the inner end oflead step 151 a, and lead offset 151 x can be angled upwardly such thatthe inner end of lead offset 151 x is higher than the outer end of leadoffset 151 x. Lead offset 151 x can be arranged at a predetermined anglewith respect to lead step 151 a. In some examples, lead offset 151 x canbe referred to as a lead upset. Lead step 151 b can be coupled to theinner end of lead offset 151 x.

Lead step 151 b can extend substantially horizontal, or substantiallyparallel to lead step 151 a. The inner end of lead step 151 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 151 b can have a length smaller thanthat of lead step 151 a. Lead step 151 b can be an example of a leadstep residing on a second plane as generally illustrated in FIG. 2B,which is different (for example, above) than the first plane asdescribed previously.

Lead offset 151 y can be coupled to the inner end of lead step 151 b.The outer end of lead offset 151 y can be coupled to the inner end oflead step 151 b, and lead offset 151 y can be angled upwardly such thatthe inner end of lead offset 151 y is higher than the outer end of leadoffset 151 y. Lead offset 151 y can be arranged at a predetermined anglewith respect to lead step 151 b. In some examples, lead offset 151 y canbe referred to as a lead upset. Lead step 151 c can be coupled to theinner end of lead offset 151 y.

Lead step 151 c can extend substantially horizontal, or substantiallyparallel to lead step 151 a. The inner end of lead step 151 c can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 151 c can have a length equal to orsmaller than that of lead step 151 b. Component interconnects 111 can becoupled to the top side of lead step 151 c. Lead step 151 c can be anexample of a lead step that resides on a third plane as generallyillustrated in FIG. 2B, which is different (for example, above) than thesecond plane described previously. In accordance with the presentdescription, lead offsets 151 x and 151 y are configured to extendbetween lead steps 151 a, 151 b, and 151 c so that the lead steps resideon different planes as generally illustrated in FIG. 2B. The top side oflead step 151 c can be an example of a lead step side, such as a firstlead step side or a second lead step side.

In some examples, lead terminal 151 z can downwardly extend from thebottom side of lead step 151 a, proximate to the outer end of lead step151 a. Lead terminal 151 z can have a length smaller than that of leadstep 151 a.

Lead 152 can comprise lead steps 152 a, 152 b, and 152 c, lead offsets152 x and 152 y, and lead terminal 152 z. Lead steps 152 a, 152 b, and152 c, lead offsets 152 x and 152 y, and lead terminal 152 z can beintegral with each other as part of a same or continuous piece. In someexamples, lead steps 152 a, 152 b, 152 c, lead offsets 152 x, 152 y, orlead terminal 152 z, can be defined by a stamping, bending, or etching.

Lead step 152 a can extend substantially horizontal, or substantiallyparallel to the first side of electronic component 11. The inner end oflead step 152 a can face towards electronic component 11 and the outerend can face away from electronic component 11. Lead step 152 a can becoupled by a tie-bar to neighboring lead steps 152 a. Lead step 152 acan be an example of a lead step residing on a fourth plane as generallyillustrated in FIG. 2B. In some examples, the fourth plane is the sameas the first plane described previously.

Lead offset 152 x can be coupled to the inner end of lead step 152 a.The outer end of lead offset 152 x can be coupled to the inner end oflead step 152 a, and lead offset 152 x can be angled upwardly such thatthe inner end of lead offset 152 x is higher than the outer end of leadoffset 152 x. Lead offset 152 x can be arranged at a predetermined anglewith respect to lead step 152 a. In some examples, lead offset 152 x canbe referred to as a lead upset. Lead step 152 b can be coupled to theinner end of lead offset 152 x.

Lead step 152 b can extend substantially horizontal, or substantiallyparallel to lead step 152 a. The inner end of lead step 152 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 152 b can have a length smaller thanthat of lead step 152 a. Lead step 152 b can be an example of a leadstep residing on a fifth plane as generally illustrated in FIG. 2B,which can be different (for example, above) than the fourth plane. Insome examples, the fifth plane can be the same as the second planedescribed previously.

Lead offset 152 y can be coupled to the inner end of lead step 152 b.The outer end of lead offset 152 y can be coupled to the inner end oflead step 152 b, and lead offset 152 y can be angled upwardly such thatthe inner end of lead offset 152 y is higher than the outer end of leadoffset 152 y. Lead offset 152 y can be arranged at a predetermined anglewith respect to lead step 152 b. In some examples, lead offset 152 y canbe referred to as a lead upset. Lead step 152 c can be coupled to theinner end of lead offset 152 y.

Lead step 152 c can extend substantially horizontal, or substantiallyparallel to lead step 152 a. The inner end of lead step 152 c can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 152 c can have a length equal orsmaller than that of lead step 152 b. Component interconnects 111 can becoupled to the top side of lead step 152 c. Lead step 152 c can be anexample of a lead step that resides on a sixth plane that is different(for example, above) than the fifth plane. In some examples, the sixthplane can be the same as the third plane described previously. Inaccordance with the present description, lead offsets 152 x and 152 yare configured to extend between lead steps 152 a, 152 b, and 152 c sothe lead steps reside on different planes as generally illustrated inFIG. 2B. The top side of lead step 152 c can be an example of a leadstep side, such as a first lead step side or a second lead step side.

In some examples, lead terminal 152 z can downwardly extend from thebottom side of lead step 152 a, proximate to the outer end of lead step152 a. Lead terminal 152 z can have a length smaller than that of leadstep 152 a.

FIG. 2C shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2C electroniccomponent 12 can be coupled to substrate 15. In some examples, a firstside of electronic component 12 can be coupled to substrate 15. In someexamples, the first side of electronic component 12 can be referred toas a front side or an active side of electronic component 12 wheredevice structures can be located. Electronic component 12 can comprisecomponent interconnects 121 coupled to lead steps 151 b and 152 b ofleads 151 and 152. In some examples, coupling of electronic component 12with substrate 15 can be secured by a reflow process. In some examples,electronic component 12 can be similar to electronic component 11. Insome examples, electronic component 11 and electronic component 11 canhave different functionality. In some examples, electronic component 12can have a thickness of about 50 μm to about 160 μm. In some examples,the size of electronic component 12 can be different (for example,larger) than that of electronic component 11. The bottom side of leadstep 152 b or the bottom side of lead step 151 b can be an example oflead step side, such as a first lead step side or a second lead stepside.

FIG. 2D shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2D, afterelectronic components 11 and 12 are coupled to substrate 15, encapsulant16 can encapsulate electronic component 11, component 12, and substrate15. In some examples, encapsulant 16 can expose a second side ofelectronic component 11 or a second side of electronic component 12 (seeFIGS. 1B and 1C). In some examples, the top side of encapsulant 16 canbe substantially coplanar with the second side of electronic component11 (see FIG. 1B). In some examples, the bottom side of encapsulant 16can be coplanar with the second side of electronic component 12 (seeFIG. 1C). In some examples, the second side of first electroniccomponent 11 and the second side of electronic component 12 can bereferred to as bottom sides or inactive sides. Bottom sides of leadterminals 151 z and 152 z can be exposed to the bottom side ofencapsulant 16 (see FIG. 1C). In the example shown in FIG. 2D, the outerlateral end of lead steps 151 a or of lead step 152 a can be exposed ata lateral side of encapsulant 16.

Encapsulant 16 can comprise or be referred to as a mold material, aprotecting material, a mold compound, or a resin. In some examples,encapsulant 16 can comprise a filler-reinforced polymer, a polymercomposite material, an epoxy resin, a polymer composite material, anepoxy resin having a filler, an epoxy acrylate having a filler, or asilicone resin. For example, encapsulant 16 can be provided using acompression molding process, transfer molding process, a film assistedmolding process, a liquid phase encapsulant molding process, a vacuumlamination process, or a paste printing process. In some examples,encapsulant 16 can have a thickness of about 350 μm to about 1000 μm.

FIG. 2E shows a cross-sectional view of semiconductor device 10 at alater stage of manufacture. In the example shown in FIG. 2E, substrate15 can be singulated into individual semiconductor devices 10 by, forexample, sawing. In some examples, the sawing can be performed using asawing tool, such as a diamond blade or laser beam. The sawing can becarried out along a boundary line between encapsulant 16 and substrate15 (indicated by a dotted line of FIG. 2E). The sawing tool can cut aportion between encapsulant 16 and substrate 15 along the boundary line.Substrate 15 can be exposed at the lateral sides of encapsulant 16 afterthe singulation. The exposed portions can be outer lateral ends of leadsteps 151 a,152 a, and bottom sides of lead terminals 151 z,152 z ofsubstrate 15.

FIGS. 3A, 3B, and 3C show different cross-sectional views of examplesemiconductor device 10 or variations of it.

FIG. 3A shows a cross-sectional view taken along the line B of FIG. 1D.In the example shown in FIG. 3A, electronic component 11 ofsemiconductor device 10 can be coupled to lead 153 of substrate 15 butneed not be coupled to lead 154. For instance, electronic component 11can be coupled to lead step 153 c of lead 153 by a componentinterconnect 111. Electronic component 12 can be coupled to lead 154 butneed not be coupled to lead 153. For instance, electronic component 12can be coupled to lead step 154 b of lead 154 by a componentinterconnect 112. The top side of lead step 153 c can be an example of alead step side, such as a first lead step side or a second lead stepside. The bottom side of lead step 154 b can be an example of a leadstep side, such as first lead step side or a second lead step side.

FIG. 3B shows a cross-sectional view of example semiconductor device10′. Features, elements, or manufacture of semiconductor device 10′ canbe similar to those described with respect to FIGS. 2A-2E. In theexample shown in FIG. 3B, semiconductor device 10′ can compriseelectronic components 11 and 12, component interconnects 111 and 121,substrate 15, and encapsulant 16. Lateral sides of lead steps 151 a,152a of substrate 15, and bottom sides of lead terminals 151 z,152 z can beexposed from encapsulant 16. In some examples, the top side ofelectronic component 11 need not be exposed from the top side ofencapsulant 16, or can be covered by encapsulant 16. In some examples,the bottom side of electronic component 12 need not be exposed from thebottom side of encapsulant 16, or can be covered by encapsulant 16. Thetop side of lead step 153 c or the top side of lead step 154 c can be anexample of a lead step side, such as a first lead step side or a secondlead step side. The bottom side of lead step 153 b or the bottom side oflead step 154 b can be an example of a lead step side, such as firstlead step side or a second lead step side. The top side of lead step 152b can be an example of a lead step side, such as a first lead step sideor a second lead step side. The bottom side of lead step 152 b can be anexample of a lead step side, such as a first lead step side or a secondlead step side.

FIG. 3C shows a cross-sectional view of example semiconductor device10″. Features, elements, or manufacture of semiconductor device 10′ canbe similar to those described with respect to FIGS. 2A-2E. In theexample shown in FIG. 3C, semiconductor device 10″ can compriseelectronic component 11, electronic component 12, electronic component13 between electronic components 11 and 12, substrate 15, andencapsulant 16. Electronic component 13 can be similar to electroniccomponent 11 or electronic component 12. Component interconnect 131 cancouple electronic component 13 to substrate 15, such as to lead step 153c.

In some examples, electronic component 11 can be coupled to lead 153 butneed not be coupled to lead 154. Electronic component 11 can be coupledto lead step 153 c of lead 153 by component interconnect 111. In someexamples, electronic component 12 can be coupled to lead 154 but neednot be coupled to lead 153. Electronic component 12 can be coupled tolead step 154 b of lead 154 by component interconnect 121. Electroniccomponent 13 can be disposed between substrate 15 and electroniccomponent 12. In some examples, electronic component 13 can be coupledto lead step 153 c by component interconnect 131, but need not becoupled to lead step 154 c. In some examples, electronic component 13can be coupled to electronic component 11 via component interconnects131, which are both coupled to lead 153 at lead step 153 c.

In some examples, the top side of electronic component 11 or the bottomside or electronic component 12 can be exposed from encapsulant 16. Insome examples, the top side of electronic component 11 or the bottomside or electronic component 12 can be covered by encapsulant 16.Encapsulant 16 can extend between electronic component 13 and electroniccomponent 12, or can extend between electronic component 13 andelectronic component 11. The top side of lead step 153 c can be anexample of a lead step side, such as a first lead step side or a secondlead step side. The bottom side of lead step 153 c can be an example ofa lead step side, such as first lead step side or a second lead stepside. The bottom side of lead step 154 b can be an example of a leadstep side, such as a first lead step side or a second lead step side.

FIG. 4A shows a cross-sectional view of example semiconductor device 20.FIG. 4B shows a perspective view of example semiconductor device 20.FIG. 4C shows a bottom view of example semiconductor device 20. FIG. 4Dshows a transparent perspective view of example semiconductor device 20.Features, elements, or manufacturing of semiconductor device 20 can besimilar to corresponding ones of other semiconductor devices orprocesses of the present disclosure, such as semiconductor device 10 orFIGS. 1-2 .

In the example shown in FIGS. 4A to 4D, semiconductor device 20 cancomprise electronic components 11 and 12, substrate 25, and encapsulant16. Electronic components 11 and 12 can comprise component interconnects111 and 121, respectively. In some examples, substrate 25 can be similarto substrate 15. Electronic components 11 and 12 can be coupled to topand bottom sides of substrate 25.

Substrate 25 and encapsulant 16 can protect the electronic components 11and 12 from an external factor and/or environmental exposure. Substrate25 and component interconnects 111 and 121 can provide electricalcoupling between an external component and electronic components 11 and12.

FIGS. 4E, 4F, and 4G show cross-sectional views of example method formanufacturing an example semiconductor device 20, with respect to line Aof FIG. 4D.

FIG. 4E shows a cross section view of electronic device 20 at an earlystage of manufacture. In the example shown in FIG. 4E, electroniccomponent 11 can be coupled to substrate 25 by interconnects 111. Insome examples, coupling of electronic component 11 with substrate 25 canbe achieved by a reflow process. In some examples, substrate 25 cancomprise or be referred to as a leadframe.

In the example shown in FIG. 4E, substrate 25 can comprise leads 251 and252 disposed opposite each other. In some examples, leads 251 and 252can have the similar shape to each other. Substrate 25 can comprisepaddle 259 between leads 251 and 252.

Lead 251 can comprise lead steps 151 a and 151 b, lead offset 151 x, andlead terminal 151 z. Lead steps 151 a and 151 b, lead offset 151 x, andlead terminal 151 z can be integral with each other as part of a same orcontinuous piece. In some examples, the different features of lead 251can be defined by stamping, bending, or etching.

Lead step 151 a can extend substantially horizontal, or substantiallyparallel to first side of electronic component 11. The inner end of leadstep 151 a can face towards electronic component 11 and the outer endcan face away from electronic component 11. Lead step 151 a can becoupled by a tie-bar to neighboring lead steps 151 a.

Lead offset 151 x can be coupled to the inner end of lead step 151 a.The outer end of lead offset 151 x can be coupled to the inner end oflead step 151 a, and lead offset 151 x can be angled upwardly such thatthe inner end of lead offset 151 x is higher than the outer end of leadoffset 151 x. Lead offset 151 x can be arranged at a predetermined anglewith respect to lead step 151 a. In some examples, lead offset 151 x canbe referred to as a lead upset. Lead step 151 b can be coupled to theinner end of lead offset 151 x.

Lead step 151 b can extend substantially horizontal, or substantiallyparallel to lead step 151 a. The inner end of lead step 151 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 151 b can have a length smaller thanthat of lead step 151 a. Component interconnects 111 of electroniccomponent 11 can be coupled to the top side of lead step 151 b.

In some examples, lead terminal 151 z can downwardly extend from thebottom side of lead step 151 a, proximate to the outer end of lead step151 a. Lead terminal 151 z can have a length smaller than that of leadstep 151 a.

Lead 252 can comprise lead steps 152 a, 152 b, lead offset 152 x, andlead terminal 152 z. Lead steps 152 a, 152 b, lead offset 152 x, andlead terminal 152 z can be integral with each other as part of a same orcontinuous piece. In some examples, lead steps 152 a, 152 b, lead offset152 x, or lead terminal 152 z, can be defined by a stamping, bending, oretching.

Lead step 152 a can extend substantially horizontal, or substantiallyparallel to first side of electronic component 11. The inner end of leadstep 152 a can face towards electronic component 11 and the outer endcan face away from electronic component 11. Lead step 152 a can becoupled by a tie-bar to neighboring lead steps 152 a.

Lead offset 152 x can be coupled to the inner end of lead step 152 a.The outer end of lead offset 152 x can be coupled to the inner end oflead step 152 a, and lead offset 152 x can be angled upwardly such thatthe inner end of lead offset 152 x is higher than the outer end of leadoffset 152 x. Lead offset 152 x can be arranged at a predetermined anglewith respect to lead step 152 a. In some examples, lead offset 152 x canbe referred to as a lead upset. Lead step 152 b can be coupled to theinner end of lead offset 152 x.

Lead step 152 b can extend substantially horizontal, or substantiallyparallel to lead step 152 a. The inner end of lead step 152 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 152 b can have a length smaller thanthat of lead step 152 a. Component interconnects 111 can be coupled tothe top side of lead step 152 b.

In some examples, lead terminal 152 z can downwardly extend from thebottom side of lead step 152 a, proximate to the outer end of lead step152 a. Lead terminal 152 z can have a length smaller than that of leadstep 152 a.

In some examples, paddle 259 can be provided by punching or etching aportion substrate 25. In some examples, paddle 259 can be substantiallycoplanar with lead steps 151 b and 152 b. Paddle 259 can comprise aground plane in some implementations. Component interconnects 111 ofelectronic component 11 can be coupled to the top side of paddle 259.Paddle 259 can comprise extensions 2591 for grounding (see FIG. 4D). Insome examples, extensions 2591 can be referred as tie bars or fingers.Extensions 2591 can be arranged spaced apart from the leads (251 and 252of FIG. 4E; 253 and 254 of FIG. 4H). In some examples, paddle 259 can beprovided in a rectangular shape, and extensions 2591 can be coupled tovertices of paddle 259.

FIG. 4F shows a cross-sectional view of semiconductor device 20 at alater stage of manufacture. In the example shown in FIG. 4F, electroniccomponent 12 can be coupled to a bottom side of substrate 25 and abottom side of paddle 259. Electronic component 12 can comprisecomponent interconnects 121. Component interconnects 121 can be coupledto lead steps 151 b,152 b of leads 251,252, or to paddle 259. In someexamples, the bottom side of electronic component 12 can be coplanarwith the bottom side of lead terminals 151 z,152 z. In some examplescoupling of electronic component 12 with substrate 25 can be achieved bya reflow process. In some examples, electronic component 12 can besimilar to electronic component 11. In other examples, electroniccomponents 11 and 12 can have different functionality. In some examples,electronic component 11 can be coupled to electronic component 12 viarespective component interconnects 111,121 that are coupled to lead 251at lead step 151 b, or coupled to lead 252 at lead step 152 b. The topside of lead step 151 b can be an example of a lead step side, such as afirst lead step side or a second lead step side. The bottom side of leadstep 151 b can be an example of a lead step side, such as first leadstep side or a second lead step side. The top side of lead step 152 bcan be an example of a lead step side, such as a first lead step side ora second lead step side. The bottom side of lead step 152 b can be anexample of a lead step side, such as a first lead step side or a secondlead step side.

FIG. 4G shows a cross-sectional view of semiconductor device 20 at alater stage of manufacture. In the example shown in FIG. 4G, afterelectronic components 11 and 12 are coupled to substrate 25, encapsulant16 can encapsulate electronic components 11 and 12 and substrate 25.Thereafter, substrate 25 can be separated into individual semiconductordevices 20 by sawing or singulation. The manufacturing stage of FIG. 4Gcan be similar to that described for the manufacturing stages of FIGS.2D and 2E. In the example shown in FIG. 4G, encapsulant 16 can exposethe top side of electronic component 11 and the bottom side ofelectronic component 12 (see FIGS. 4B and 4C). In some examples, the topside of encapsulant 16 can be substantially coplanar with the top sideof electronic component 11 (see FIG. 4B). In some examples, the bottomside of encapsulant 16 can be coplanar with the bottom side ofelectronic component 12 (see FIG. 4C). Bottom sides of lead terminals151 z,152 z can be exposed at the bottom side of encapsulant 16 (seeFIG. 4C). Outer lateral ends of lead steps 151 a,152 a can be exposed atthe lateral sides of encapsulant 16 after singulation.

FIG. 4H shows a cross-sectional view taken along the line B of FIG. 4D.As seen in FIG. 4H, electronic component 11 can be coupled to lead 253and paddle 259 but need not be coupled to lead 254. In some examples,electronic component 11 can be coupled to lead step 153 b of lead 253and paddle 259 by component interconnects 111. Electronic component 12can be coupled to lead 254 and paddle 259 but need not be coupled tolead 253. In some examples, electronic component 12 can be coupled tolead step 154 b of lead 254 and paddle 259 by interconnects 121.

FIG. 4I shows a cross-sectional view taken along the line C of FIG. 4D.As shown in FIG. 4I, electronic components 11 and 12 can be coupled topaddle 259. In some examples, electronic component 11 can be coupled topaddle 259 by component interconnects 111, and electronic component 12can be coupled to paddle 259 by component interconnects 121.

Substrate 25 can comprise paddle 259 and extensions 2591 and 2592 eachhaving extension terminals 2591 z and 2592 z respectively. In someexamples, extensions 2591 and 2592 can be referred as tie bars orfingers. Extensions 2591 and 2592 can be similar to leads 251, 252, 253,and 254, but are coupled to paddle 259. Paddle 259 and extensions 2591and 2592 can be integral with each other as part of a same or continuouspiece. In some examples, paddle 259 can be positioned between electroniccomponent 11 and electronic component 12 and can be parallel withelectronic components 11 and 12. Extension 2591 can be coupled to oneend of paddle 259, and extension 2592 can be coupled to another end ofpaddle 259. Top sides of extensions 2591 and 2592 can be positioned tobe lower than paddle 259. In some examples, extension 2591 and extension2592 can be symmetrical with each other. Extension terminal 2591 z canbe provided under extension 2591, and extension terminal 2592 z can beprovided under extension 2592. The bottom sides of extension terminals2591 z and 2592 z can be exposed at a bottom side of encapsulant 16.Outer lateral ends of extension terminals 2591 z and 2592 z can beexposed at a lateral side of encapsulant 16.

FIG. 5A shows a cross-sectional view of an example semiconductor device30. FIG. 5B shows a perspective view of example semiconductor device 30.FIG. 5C shows a bottom view of example semiconductor device 30. FIG. 5Dshows a transparent perspective view of example semiconductor device 30.Features, elements, or manufacturing of semiconductor device 30 can besimilar to corresponding ones of other semiconductor devices orprocesses of the present disclosure, such as semiconductor device 10 or20 or FIGS. 1-4 .

In the example shown in FIGS. 5A to 5D, semiconductor device 30 cancomprise electronic components 11 and 12, substrate 35, and encapsulant16. Electronic components 11 and 12 can comprise component interconnects111 and 121, respectively. In some examples, substrate 35 can be similarto substrate 15 or 25. Electronic components 11 and 12 can be coupled tothe top side of substrate 35.

Substrate 35 and encapsulant 16 can protect the electronic components 11and 12 from an external factor and/or environmental exposure. Substrate35 and component interconnects 111 and 121 can provide electricalcoupling between an external component and electronic components 11 and12.

FIGS. 5E, 5F, 5G, and 5H show cross-sectional views of an example methodfor manufacturing an example semiconductor device 30, with respect toline A of FIG. 5D.

FIG. 5E shows a cross section view of electronic device 30 at an earlystage of manufacture. In the example shown in FIG. 5E, electroniccomponent 12 having component interconnects 121 can be coupled tosubstrate 35. In some examples, coupling of electronic component 12 withsubstrate 35 can be achieved by a reflow process. In some examples,substrate 35 can comprise or be referred to as a leadframe. In someexamples, a portion of the top side of lead 351 or lead 352 can behigher than the bottom side of electronic component 12.

In the example shown in FIG. 5E, substrate 25 can comprise leads 351 and352 disposed opposite each other. Leads 351 and 352 can have the similarshape to each other.

Lead 351 can comprise lead steps 151 a, 151 b, and 351 c, lead offsets151 x and 351 y, and lead terminal 151 z. Lead steps 151 a, 151 b, and351 c, lead offsets 151 x and 351 y, and lead terminal 151 z can beintegral with each other as part of a same or continuous piece. In someexamples, lead steps 151 a, 151 b, 351 c, lead offsets 151 x, 351 y, orlead terminal 351 z, can be defined by stamping, bending, or etching.

Lead step 151 a can extend substantially horizontal, or substantiallyparallel to the first side of electronic component 11. The inner end oflead step 151 a can face towards electronic component 11 and the outerend can face away from electronic component 11. Lead step 151 a can becoupled by a tie-bar to neighboring lead steps 151 a. Lead step 151 acan be an example of a lead step that resides on a first plane, such asa horizontal plane, as generally illustrated in FIG. 5E.

Lead offset 151 x can be coupled to the inner end of lead step 151 a.The outer end of lead offset 151 x can be coupled to the inner end oflead step 151 a, and lead offset 151 x can be angled upwardly such thatthe inner end of lead offset 151 x is higher than the outer end of leadoffset 151 x. Lead offset 151 x can be arranged at a predetermined anglewith respect to lead step 151 a. In some examples, lead offset 151 x canbe referred to as a lead upset.

Lead step 151 b can be coupled to the inner end of lead offset 151 x.Lead step 151 b can extend substantially horizontal, or substantiallyparallel to lead step 151 a. The inner end of lead step 151 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 151 b can have a length smaller thanthat of lead step 151 a. Lead step 151 b can be an example of a leadstep residing on a second plane as generally illustrated in FIG. 5E,which is different (for example, above) the first plane as describedpreviously.

Lead offset 351 y can be coupled to the inner end of lead step 151 b.The outer end of lead offset 351 y can be coupled to the inner end oflead step 151 b, and lead offset 351 y can be angled downwardly suchthat the inner end of lead offset 351 y is lower than the outer end oflead offset 351 y. Lead offset 351 y can be arranged at a predeterminedangle with respect to lead step 151 b. In some examples, lead offset 351y can be referred to as a lead downset.

Lead step 351 c can be coupled to the inner end of lead offset 351 y.Lead step 351 c can extend substantially horizontal, or substantiallyparallel to lead step 151 a. The inner end of lead step 351 c can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 351 c can have a length equal orsmaller than that of lead step 151 b. Component interconnects 111 can becoupled to the top side of lead step 351 c. Lead step 351 c can be anexample of a lead step that resides on a third plane as generallyillustrated in FIG. 5E, which is different (for example, below) thesecond plane described previously. In examples, the third plane can bethe same as the first plane.

In some examples, lead terminal 151 z can downwardly extend from thebottom side of lead step 151 a, proximate to the outer end of lead step151 a. Lead terminal 151 z can have a length smaller than that of leadstep 151 a.

Lead 352 can comprise lead steps 152 a, 152 b, and 352 c, lead offsets152 x and 352 y, and lead terminal 152 z. Lead steps 152 a, 152 b, and352 c, lead offsets 152 x and 352 y, and lead terminal 152 z can beintegral with each other as part of a same or continuous piece. In someexamples, lead steps 152 a, 152 b, 352 c, lead offsets 152 x, 152 y, orlead terminal 352 z, can be defined by stamping, bending, or etching.

Lead step 152 a can extend substantially horizontal, or substantiallyparallel to the first side of electronic component 11. The inner end oflead step 152 a can face towards electronic component 11 and the outerend can face away from electronic component 11. Lead step 152 a can becoupled by a tie-bar to neighboring lead steps 152 a. Lead step 152 acan be an example of a lead step that resides on a fourth plane, such asa horizontal plane, as generally illustrated in FIG. 5E. In someexamples, the fourth plane can be the same as the first plane.

Lead offset 152 x can be coupled to the inner end of lead step 152 a.The outer end of lead offset 152 x can be coupled to the inner end oflead step 152 a, and lead offset 152 x can be angled upwardly such thatthe inner end of lead offset 152 x is higher than the outer end of leadoffset 152 x. Lead offset 152 x can be arranged at a predetermined anglewith respect to lead step 152 a. In some examples, lead offset 152 x canbe referred to as a lead upset.

Lead step 152 b can be coupled to the inner end of lead offset 152 x.Lead step 152 b can extend substantially horizontal, or substantiallyparallel to lead step 152 a. The inner end of lead step 152 b can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 152 b can have a length smaller thanthat of lead step 152 a. Lead step 152 b can be an example of a leadstep residing on a fifth plane as generally illustrated in FIG. 5E,which is different (for example, above) the fourth plane as describedpreviously. In some examples, the fifth plane can be the same as thethird plane.

Lead offset 352 y can be coupled to the inner end of lead step 152 b.The outer end of lead offset 352 y can be coupled to the inner end oflead step 152 b, and lead offset 352 y can be angled downwardly suchthat the inner end of lead offset 352 y is lower than the outer end oflead offset 352 y. Lead offset 352 y can be arranged at a predeterminedangle with respect to lead step 152 b. In some examples, lead offset 352y can be referred to as a lead downset.

Lead step 352 c can be coupled to the inner end of lead offset 352 y.Lead step 352 c can extend substantially horizontal, or substantiallyparallel to lead step 152 a. The inner end of lead step 352 c can facetowards electronic component 11 and the outer end can face away fromelectronic component 11. Lead step 352 c can have a length equal orsmaller than that of lead step 152 b. Component interconnects 111 can becoupled to the top side of lead step 352 c. Lead step 352 c can be anexample of a lead step that resides on a sixth plane as generallyillustrated in FIG. 5E, which is different (for example, below) thefifth plane as described previously. In some examples, the sixth planecan be the same as third plane.

In some examples, lead terminal 152 z can downwardly extend from thebottom side of lead step 152 a, proximate to the outer end of lead step152 a. Lead terminal 152 z can have a length smaller than that of leadstep 152 a.

FIG. 5F shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 5F, electroniccomponent 11 can positioned over electronic component 12 and coupled tosubstrate 35. In some examples, electronic component 11 can be coupledto top sides of lead steps 151 b and 152 b. In some cross-sections,electronic component 11 can have a larger width than electroniccomponent 12. In some examples, electronic component 11 and electroniccomponent 12 can be coupled. In some examples, electronic component 11can be coupled to electronic component 12 via respective componentinterconnects 111 and 121 that are coupled to lead 351 or lead 352. Thetop side of lead step 151 b can be an example of a lead step side, suchas a first lead step side or a second lead step side. The top side oflead step 351 c can be an example of a lead step side, such as firstlead step side or a second lead step side. The top side of lead step 152b can be an example of a lead step side, such as a first lead step sideor a second lead step side. The top side of lead step 352 c can be anexample of a lead step side, such as a first lead step side or a secondlead step side.

FIG. 5G shows a cross-sectional view of semiconductor device 30 at alater stage of manufacture. In the example shown in FIG. 5G, afterelectronic components 11 and 12 are coupled to substrate 35, encapsulant16 can encapsulate electronic components 11 and 12 and substrate 25.Substrate 35 and encapsulant 16 can be singulated to define individualsemiconductor devices 30. The manufacturing stage of FIG. 5G can besimilar to the manufacturing stages of FIGS. 2D-2E. In some examples,the top side of electronic component 11 can be exposed from encapsulant16 (see FIG. 5B). In some examples, the top side of electronic component11 can be covered by encapsulant 16. In some examples, encapsulant 16can fill a space between electronic component 11 and electroniccomponent 12. The bottom sides of lead terminals 151 z and 152 z can beexposed from the bottom side of encapsulant 16 (see FIG. 5C). Bottomsides of lead terminals 151 z,152 z can be exposed at the bottom side ofencapsulant 16 (see FIG. 5C). Outer lateral ends of lead steps 151 a,152a can be exposed at the lateral sides of encapsulant 16 aftersingulation.

FIG. 5H shows a cross-sectional view taken along the line B of FIG. 5D.As seen in FIG. 5H, electronic component 11 can be coupled to lead 354but need not be coupled to lead 353. In some examples, electroniccomponent 11 can be coupled to lead step 154 b of lead 354 by componentinterconnect 111. Electronic component 12 can be coupled to lead 353 butneed not be coupled to lead 354. In some examples, electronic component12 can be coupled to lead step 353 c of lead 353 by interconnect 121.

The present disclosure includes reference to certain examples; however,it will be understood by those skilled in the art that various changesmay be made and equivalents may be substituted without departing fromthe scope of the disclosure. For example, additional lead steps and leadoffsets can be used. In addition, modifications may be made to thedisclosed examples without departing from the scope of the presentdisclosure. Therefore, it is intended that the present disclosure not belimited to the examples disclosed, but that the disclosure will includeall examples falling within the scope of the appended claims.

What is claim is:
 1. A method of manufacturing a semiconductor device,comprising: providing a substrate comprising leads, the leadscomprising: lead terminals; lead steps; and lead offsets extendingbetween the lead steps so that at least some lead steps reside ondifferent planes; providing a first electronic component coupled to afirst lead step side, the first electronic component comprising: a firstelectronic component first side comprising a first active side; and afirst electronic component second side opposite to the first electroniccomponent first side; providing a second electronic component coupled toa second lead step side, the second electronic component comprising: asecond electronic component first side comprising a second active side;and a second electronic component second side opposite to the secondelectronic component first side; providing conductive bumps comprising afirst conductive bump and a second conductive bump; and providing anencapsulant encapsulating the first electronic component, the secondelectronic component, the first conductive bump, the second conductivebump, and portions of the substrate, wherein: the first active sidefaces and is connected to the first lead step side with the firstconductive bump; the second active side faces and is connected to thesecond lead step side with the second conductive bump; the leadterminals are exposed from a first side of the encapsulant; the firstelectronic component second side is exposed from a second side of theencapsulant; and the second side of the encapsulant is different thanthe first side of the encapsulant.